BYCHIPS is the stocking distributor for UF5A600D1-13, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for UF5A600D1-13 by email, we will give you a best price according your plan.
Buy UF5A600D1-13 with BYCHPS
Buy with guarantee
UF5A600D1-13
- Part Number:
- UF5A600D1-13
- Manufacturer:
- Diodes Incorporated
- Description:
- DIODE GEN PURP 600V 5A TO252-3
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15906 Pieces
- Data sheet:
- UF5A600D1-13.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 1.9V @ 5A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 600V |
| Supplier Device Package: | TO-252-3 |
| Speed: | Fast Recovery = 200mA (Io) |
| Series: | - |
| Reverse Recovery Time (trr): | 30ns |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Other Names: | UF5A600D1-13DI |
| Operating Temperature - Junction: | -65°C ~ 175°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | UF5A600D1-13 |
| Expanded Description: | Diode Standard 600V 5A Surface Mount TO-252-3 |
| Diode Type: | Standard |
| Description: | DIODE GEN PURP 600V 5A TO252-3 |
| Current - Reverse Leakage @ Vr: | 10µA @ 600V |
| Current - Average Rectified (Io): | 5A |
| Capacitance @ Vr, F: | 50pF @ 10V, 1MHz |
| Email: | [email protected] |
Related parts for UF5A600D1-13
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers