BYCHIPS is the stocking distributor for TEA6360T/V2,518, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TEA6360T/V2,518 by email, we will give you a best price according your plan.
Buy TEA6360T/V2,518 with BYCHPS
Buy with guarantee
TEA6360T/V2,518
- Part Number:
- TEA6360T/V2,518
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC STEREO EQUALIZER CIRC 32SO
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15997 Pieces
- Data sheet:
- TEA6360T/V2,518.pdf
Introduction
Specifications
| Voltage - Supply: | 7 V ~ 13.2 V |
|---|---|
| Supplier Device Package: | 32-SO |
| Specifications: | 5-Band |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 32-SOIC (0.295", 7.50mm Width) |
| Other Names: | 935053480518 TEA6360TD-T TEA6360TD-T-ND |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of Channels: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | TEA6360T/V2,518 |
| Interface: | I²C |
| Function: | Audio Tone Processor |
| Expanded Description: | Audio Audio Tone Processor 2 Channel 32-SO |
| Description: | IC STEREO EQUALIZER CIRC 32SO |
| Applications: | Automotive Audio, Consumer Audio |
| Email: | [email protected] |
Related parts for TEA6360T/V2,518
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
TEA6324T/V1,518 | NXP USA Inc. | IC SOUND CNTRL I2C 24-SOIC | Inquiry |
 |
DIX4192IPFBG4 | Texas Instruments | IC DIGITAL AUDIO DIT/DIR 48-TQFP | Inquiry |
 |
TEA6360T/V2,512 | NXP USA Inc. | IC STEREO EQUALIZER 32SO | Inquiry |
|
DIT4096IPWG4 | Texas Instruments | IC DIG AUDIO TRANSMTR 5V 28TSSOP | Inquiry |
|
TEA6321T/V1,518 | NXP USA Inc. | IC SOUND FADER CONTROL 32SO | Inquiry |
|
TEA6321T/V1,512 | NXP USA Inc. | IC SOUND FADER CONTROL 32SO | Inquiry |
|
TEA6320T/V1,518 | NXP USA Inc. | IC SOUND FADER CONTROL 32SO | Inquiry |
|
TEA6320T/V1,512 | NXP USA Inc. | IC SOUND FADER CONTROL 32SO | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers