BYCHIPS is the stocking distributor for TDA19989AET/C181'5, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TDA19989AET/C181'5 by email, we will give you a best price according your plan.
Buy TDA19989AET/C181'5 with BYCHPS
Buy with guarantee
TDA19989AET/C181'5
- Part Number:
- TDA19989AET/C181'5
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC HDMI INTERFACE 64TFBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17273 Pieces
- Data sheet:
- TDA19989AET/C181'5.pdf
Introduction
Specifications
| Type: | HDMI 1.3 Transmitter |
|---|---|
| Supplier Device Package: | 64-TFBGA (4.5x4.5) |
| Series: | - |
| Packaging: | Tray |
| Package / Case: | 64-TFBGA |
| Other Names: | 935293853557 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | TDA19989AET/C181'5 |
| Description: | IC HDMI INTERFACE 64TFBGA |
| Applications: | Video Camera |
| Email: | [email protected] |
Related parts for TDA19989AET/C181'5
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
TDA19989AET/C185:5 | NXP USA Inc. | IC HDMI INTERFACE 1.3A 64TFBGA | Inquiry |
|
TDA19989AET/C185,5 | NXP USA Inc. | IC HDMI INTERFACE 1.3A 64TFBGA | Inquiry |
|
TDA19989AET/C181,5 | NXP USA Inc. | IC HDMI INTERFACE 64TFBGA | Inquiry |
|
TDA19989AET/C181:5 | NXP USA Inc. | IC HDMI INTERFACE 64TFBGA | Inquiry |
|
TDA19989AET/C189,5 | NXP USA Inc. | IC HDMI INTERFACE 1.3A 64TFBGA | Inquiry |
|
TDA19989BET/C1,551 | NXP USA Inc. | IC HDMI INTERFACE 64TFBGA | Inquiry |
|
TDA19989AETC189,55 | NXP USA Inc. | IC HDMI INTERFACE 1.4A 64TFBGA | Inquiry |
|
TDA19989BET/C1,557 | NXP USA Inc. | IC HDMI INTERFACE 64TFBGA | Inquiry |
|
TDA19989BET/C1,518 | NXP USA Inc. | IC HDMI INTERFACE 64TFBGA | Inquiry |
|
TDA19989AET/C185'5 | NXP USA Inc. | IC HDMI INTERFACE 1.3A 64TFBGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers