BYCHIPS is the stocking distributor for TC7SZ34AFS,L3F, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TC7SZ34AFS,L3F by email, we will give you a best price according your plan.
Buy TC7SZ34AFS,L3F with BYCHPS
Buy with guarantee
TC7SZ34AFS,L3F
- Part Number:
- TC7SZ34AFS,L3F
- Manufacturer:
- Toshiba Semiconductor
- Description:
- IC BUFFER UHS SGL FSV
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19508 Pieces
- Data sheet:
- TC7SZ34AFS,L3F.pdf
Introduction
Specifications
| Voltage - Supply: | 1.65 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | fSV |
| Series: | TC7SZ |
| Packaging: | Original-Reel® |
| Package / Case: | SOT-953 |
| Output Type: | Push-Pull |
| Other Names: | TC7SZ34AFS(TPL3)DKR TC7SZ34AFS(TPL3)DKR-ND TC7SZ34AFSL3FDKR |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of Elements: | 1 |
| Number of Bits per Element: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | TC7SZ34AFS,L3F |
| Logic Type: | Buffer, Non-Inverting |
| Input Type: | - |
| Expanded Description: | Buffer, Non-Inverting Element 1 Bit per Element Push-Pull Output fSV |
| Description: | IC BUFFER UHS SGL FSV |
| Current - Output High, Low: | 32mA, 32mA |
| Email: | [email protected] |
Related parts for TC7SZ34AFS,L3F
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers