BYCHIPS is the stocking distributor for TC7SH32FS,L3F, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TC7SH32FS,L3F by email, we will give you a best price according your plan.
Buy TC7SH32FS,L3F with BYCHPS
Buy with guarantee
TC7SH32FS,L3F
- Part Number:
- TC7SH32FS,L3F
- Manufacturer:
- Toshiba Semiconductor
- Description:
- IC GATE OR 1CH 2-INP FSV
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18541 Pieces
- Data sheet:
- TC7SH32FS,L3F.pdf
Introduction
Specifications
| Voltage - Supply: | 2 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | fSV |
| Series: | TC7SH |
| Packaging: | Cut Tape (CT) |
| Package / Case: | SOT-953 |
| Other Names: | TC7SH32FSL3FCT |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Inputs: | 2 |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Max Propagation Delay @ V, Max CL: | 7.5ns @ 5V, 50pF |
| Manufacturer Part Number: | TC7SH32FS,L3F |
| Logic Type: | OR Gate |
| Logic Level - Low: | 0.5V |
| Logic Level - High: | 1.5V |
| Features: | - |
| Expanded Description: | OR Gate IC 1 Channel fSV |
| Description: | IC GATE OR 1CH 2-INP FSV |
| Current - Quiescent (Max): | 2µA |
| Current - Output High, Low: | 8mA, 8mA |
| Email: | [email protected] |
Related parts for TC7SH32FS,L3F
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers