BYCHIPS is the stocking distributor for TC75S55FU(TE85L,F), we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TC75S55FU(TE85L,F) by email, we will give you a best price according your plan.
Buy TC75S55FU(TE85L,F) with BYCHPS
Buy with guarantee
TC75S55FU(TE85L,F)
- Part Number:
- TC75S55FU(TE85L,F)
- Manufacturer:
- Toshiba Semiconductor
- Description:
- IC OP AMP GP CMOS USV
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17035 Pieces
- Data sheet:
- TC75S55FU(TE85L,F).pdf
Introduction
Specifications
| Voltage - Supply, Single/Dual (±): | 3.5 V ~ 7 V, ±0.9 V ~ 1.8 V |
|---|---|
| Voltage - Input Offset: | 2mV |
| Supplier Device Package: | USV |
| Slew Rate: | 0.7 V/µs |
| Series: | - |
| Packaging: | Original-Reel® |
| Package / Case: | 5-TSSOP, SC-70-5, SOT-353 |
| Output Type: | - |
| Other Names: | TC75S55FU(TE85LF)DKR |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | TC75S55FU(TE85L,F) |
| Expanded Description: | General Purpose Amplifier 1 Circuit USV |
| Description: | IC OP AMP GP CMOS USV |
| Current - Supply: | 10µA |
| Current - Output / Channel: | 700µA |
| Current - Input Bias: | 1pA |
| Amplifier Type: | General Purpose |
| -3db Bandwidth: | - |
| Email: | [email protected] |
Related parts for TC75S55FU(TE85L,F)
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers