BYCHIPS is the stocking distributor for TC74HC4066AF-ELF, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TC74HC4066AF-ELF by email, we will give you a best price according your plan.
Buy TC74HC4066AF-ELF with BYCHPS
Buy with guarantee
TC74HC4066AF-ELF
- Part Number:
- TC74HC4066AF-ELF
- Manufacturer:
- Toshiba Semiconductor
- Description:
- IC MUX/DEMUX QUAD SPST SOP14
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18163 Pieces
- Data sheet:
- TC74HC4066AF-ELF.pdf
Introduction
Specifications
| Voltage - Supply, Single (V+): | 2 V ~ 12 V |
|---|---|
| Voltage - Supply, Dual (V±): | - |
| Switch Time (Ton, Toff) (Max): | 12ns, 18ns |
| Switch Circuit: | SPST - NO |
| Supplier Device Package: | 14-SOP |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 14-SOIC (0.209", 5.30mm Width) |
| Other Names: | TC74HC4066AF(EL,F) TC74HC4066AF-ELFTR |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| On-State Resistance (Max): | 80 Ohm |
| Number of Circuits: | 4 |
| Multiplexer/Demultiplexer Circuit: | 1:1 |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | TC74HC4066AF-ELF |
| Expanded Description: | 4 Circuit IC Switch 1:1 80 Ohm 14-SOP |
| Description: | IC MUX/DEMUX QUAD SPST SOP14 |
| Current - Leakage (IS(off)) (Max): | 1µA |
| Crosstalk: | -60dB @ 1MHz |
| Charge Injection: | - |
| Channel-to-Channel Matching (ΔRon): | 5 Ohm |
| Channel Capacitance (CS(off), CD(off)): | 10pF |
| -3db Bandwidth: | 200MHz |
| Email: | [email protected] |
Related parts for TC74HC4066AF-ELF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers