BYCHIPS is the stocking distributor for T77S1D10-03, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for T77S1D10-03 by email, we will give you a best price according your plan.
Buy T77S1D10-03 with BYCHPS
Buy with guarantee
T77S1D10-03
- Part Number:
- T77S1D10-03
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Description:
- RELAY GEN PURPOSE SPST 10A 3V
- Lead Free Status / RoHS Status:
- Contains lead / RoHS Compliant
- Available Quantity:
- 12882 Pieces
- Data sheet:
- 1.T77S1D10-03.pdf2.T77S1D10-03.pdf
Introduction
Specifications
| Turn On Voltage (Max): | 2.25 VDC |
|---|---|
| Turn Off Voltage (Min): | 0.15 VDC |
| Termination Style: | PC Pin |
| Switching Voltage: | 250VAC, 30VDC - Max |
| Series: | T77 |
| Release Time: | 4ms |
| Relay Type: | General Purpose |
| Packaging: | Bulk |
| Other Names: | 1393194-6 1393194-6-ND |
| Operating Temperature: | -30°C ~ 85°C |
| Operate Time: | 10ms |
| Mounting Type: | Through Hole |
| Manufacturer Standard Lead Time: | 19 Weeks |
| Manufacturer Part Number: | T77S1D10-03 |
| Features: | Insulation - Class F, Sealed - Fully |
| Expanded Description: | General Purpose Relay SPST-NO (1 Form A) 3VDC Coil Through Hole |
| Description: | RELAY GEN PURPOSE SPST 10A 3V |
| Contact Rating (Current): | 10A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | SPST-NO (1 Form A) |
| Coil Voltage: | 3VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 20 Ohms |
| Coil Power: | 450 mW |
| Coil Current: | 150mA |
| Email: | [email protected] |
Related parts for T77S1D10-03
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers