BYCHIPS is the stocking distributor for STGW30H60DFB, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for STGW30H60DFB by email, we will give you a best price according your plan.
Buy STGW30H60DFB with BYCHPS
Buy with guarantee
STGW30H60DFB
- Part Number:
- STGW30H60DFB
- Manufacturer:
- ST
- Description:
- IGBT 600V 60A 260W TO247
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15507 Pieces
- Data sheet:
- STGW30H60DFB.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 600V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 2V @ 15V, 30A |
| Test Condition: | 400V, 30A, 10 Ohm, 15V |
| Td (on/off) @ 25°C: | 37ns/146ns |
| Switching Energy: | 383µJ (on), 293µJ (off) |
| Supplier Device Package: | TO-247 |
| Series: | - |
| Reverse Recovery Time (trr): | 53ns |
| Power - Max: | 260W |
| Packaging: | Tube |
| Package / Case: | TO-247-3 |
| Other Names: | 497-15133-5 |
| Operating Temperature: | -55°C ~ 175°C (TJ) |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 20 Weeks |
| Manufacturer Part Number: | STGW30H60DFB |
| Input Type: | Standard |
| IGBT Type: | Trench Field Stop |
| Gate Charge: | 149nC |
| Expanded Description: | IGBT Trench Field Stop 600V 60A 260W Through Hole TO-247 |
| Description: | IGBT 600V 60A 260W TO247 |
| Current - Collector Pulsed (Icm): | 120A |
| Current - Collector (Ic) (Max): | 60A |
| Email: | [email protected] |
Related parts for STGW30H60DFB
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers