BYCHIPS is the stocking distributor for SN75LVDS9637DRG4, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SN75LVDS9637DRG4 by email, we will give you a best price according your plan.
Buy SN75LVDS9637DRG4 with BYCHPS
Buy with guarantee
SN75LVDS9637DRG4
- Part Number:
- SN75LVDS9637DRG4
- Manufacturer:
- Description:
- IC DIFF RCVR DUAL HS 8-SOIC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12765 Pieces
- Data sheet:
- SN75LVDS9637DRG4.pdf
Introduction
Specifications
| Voltage - Supply: | 3 V ~ 3.6 V |
|---|---|
| Type: | Receiver |
| Supplier Device Package: | 8-SOIC |
| Series: | - |
| Protocol: | LVDS |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 8-SOIC (0.154", 3.90mm Width) |
| Operating Temperature: | 0°C ~ 70°C |
| Number of Drivers/Receivers: | 0/2 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | SN75LVDS9637DRG4 |
| Expanded Description: | 0/2 Receiver LVDS 8-SOIC |
| Duplex: | - |
| Description: | IC DIFF RCVR DUAL HS 8-SOIC |
| Data Rate: | 155Mbps |
| Email: | [email protected] |
Related parts for SN75LVDS9637DRG4
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
SN75LVDS9638DGKRG4 | Texas Instruments | IC DIFF RCVR DUAL HS 8VSSOP | Inquiry |
|
SN75LVDS9638DRG4 | Texas Instruments | IC DIFF RCVR DUAL HS 8-SOIC | Inquiry |
|
SN75LVDS9637D | Texas Instruments | IC DIFF RCVR DUAL HS 8-SOIC | Inquiry |
|
SN75LVDS9638D | Texas Instruments | IC DIFF DRVR DUAL HS 8-SOIC | Inquiry |
|
SN75LVDS9638DGK | Texas Instruments | IC DIFF RCVR DUAL HS 8VSSOP | Inquiry |
|
SN75LVDS9637DR | Texas Instruments | IC DIFF RCVR DUAL HS 8-SOIC | Inquiry |
|
SN75LVDS9638DGKR | Texas Instruments | IC DIFF RCVR DUAL HS 8VSSOP | Inquiry |
|
SN75LVDS9638DR | Texas Instruments | IC DIFF RCVR DUAL HS 8-SOIC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers