BYCHIPS is the stocking distributor for SI5429DU-T1-GE3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SI5429DU-T1-GE3 by email, we will give you a best price according your plan.
Buy SI5429DU-T1-GE3 with BYCHPS
Buy with guarantee
SI5429DU-T1-GE3
- Part Number:
- SI5429DU-T1-GE3
- Manufacturer:
- Vishay / Siliconix
- Description:
- MOSFET P-CH 30V 12A PWR PK
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16561 Pieces
- Data sheet:
- SI5429DU-T1-GE3.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 2.2V @ 250µA |
|---|---|
| Technology: | MOSFET (Metal Oxide) |
| Supplier Device Package: | PowerPAK® ChipFet Dual |
| Series: | TrenchFET® |
| Rds On (Max) @ Id, Vgs: | 15 mOhm @ 7A, 10V |
| Power Dissipation (Max): | 3.1W (Ta), 31W (Tc) |
| Packaging: | Original-Reel® |
| Package / Case: | PowerPAK® ChipFET™ Dual |
| Other Names: | SI5429DU-T1-GE3DKR |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | SI5429DU-T1-GE3 |
| Input Capacitance (Ciss) (Max) @ Vds: | 2320pF @ 15V |
| Gate Charge (Qg) (Max) @ Vgs: | 63nC @ 10V |
| FET Type: | P-Channel |
| FET Feature: | - |
| Expanded Description: | P-Channel 30V 12A (Tc) 3.1W (Ta), 31W (Tc) Surface Mount PowerPAK® ChipFet Dual |
| Drain to Source Voltage (Vdss): | 30V |
| Description: | MOSFET P-CH 30V 12A PWR PK |
| Current - Continuous Drain (Id) @ 25°C: | 12A (Tc) |
| Email: | [email protected] |
Related parts for SI5429DU-T1-GE3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers