BYCHIPS is the stocking distributor for S40410161B1B2W013, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for S40410161B1B2W013 by email, we will give you a best price according your plan.
Buy S40410161B1B2W013 with BYCHPS
Buy with guarantee
S40410161B1B2W013
- Part Number:
- S40410161B1B2W013
- Manufacturer:
- Cypress Semiconductor
- Description:
- IC FLASH 16GBIT 200MHZ 100BGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13225 Pieces
- Data sheet:
- S40410161B1B2W013.pdf
Introduction
Specifications
| Voltage - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 100-LBGA (14x18) |
| Speed: | 200MHz |
| Series: | e.MMC 1B1 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 100-LBGA |
| Operating Temperature: | -25°C ~ 85°C (TA) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Memory Type: | Non-Volatile |
| Memory Size: | 16Gb (2G x 8) |
| Memory Format: | FLASH |
| Manufacturer Part Number: | S40410161B1B2W013 |
| Interface: | Parallel |
| Description: | IC FLASH 16GBIT 200MHZ 100BGA |
| Email: | [email protected] |
Related parts for S40410161B1B2W013
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
S40410161B1B1I010 | Cypress Semiconductor Corp | IC FLASH 16GBIT 200MHZ 153FBGA | Inquiry |
|
S40410161B1B2I013 | Cypress Semiconductor Corp | IC FLASH 16GBIT 200MHZ 100BGA | Inquiry |
|
S40410161B1B1I013 | Cypress Semiconductor Corp | IC FLASH 16GBIT 200MHZ 153FBGA | Inquiry |
|
S40410161B1B2W010 | Cypress Semiconductor Corp | IC FLASH 16GBIT 200MHZ 100BGA | Inquiry |
|
S40410161B1B1W013 | Cypress Semiconductor Corp | IC FLASH 16GBIT 200MHZ 153FBGA | Inquiry |
|
S40410161B1B2I010 | Cypress Semiconductor Corp | IC FLASH 16GBIT 200MHZ 100BGA | Inquiry |
|
S40410161B1B1W010 | Cypress Semiconductor Corp | IC FLASH 16GBIT 200MHZ 153FBGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers