BYCHIPS is the stocking distributor for RMCF0603FT237K, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RMCF0603FT237K by email, we will give you a best price according your plan.
Buy RMCF0603FT237K with BYCHPS
Buy with guarantee
RMCF0603FT237K
- Part Number:
- RMCF0603FT237K
- Manufacturer:
- Stackpole Electronics, Inc.
- Description:
- RES SMD 237K OHM 1% 1/10W 0603
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14744 Pieces
- Data sheet:
- 1.RMCF0603FT237K.pdf2.RMCF0603FT237K.pdf
Introduction
Specifications
| Tolerance: | ±1% |
|---|---|
| Temperature Coefficient: | ±100ppm/°C |
| Supplier Device Package: | 0603 |
| Size / Dimension: | 0.061" L x 0.031" W (1.55mm x 0.80mm) |
| Series: | RMCF |
| Resistance (Ohms): | 237k |
| Power (Watts): | 0.1W, 1/10W |
| Packaging: | Original-Reel® |
| Package / Case: | 0603 (1608 Metric) |
| Other Names: | RMCF0603FT237KDKR RMCF1/16237K1%RDKR RMCF1/16237K1%RDKR-ND RMCF1/16237KFRDKR RMCF1/16237KFRDKR-ND |
| Operating Temperature: | -55°C ~ 155°C |
| Number of Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | RMCF0603FT237K |
| Height - Seated (Max): | 0.022" (0.55mm) |
| Features: | Automotive AEC-Q200 |
| Failure Rate: | - |
| Expanded Description: | 237k Ohm ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Automotive AEC-Q200 Thick Film |
| Description: | RES SMD 237K OHM 1% 1/10W 0603 |
| Composition: | Thick Film |
| Email: | [email protected] |
Related parts for RMCF0603FT237K
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers