BYCHIPS is the stocking distributor for QSZ1TR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for QSZ1TR by email, we will give you a best price according your plan.
Buy QSZ1TR with BYCHPS
Buy with guarantee
QSZ1TR
- Part Number:
- QSZ1TR
- Manufacturer:
- LAPIS Semiconductor
- Description:
- TRANS NPN/PNP 15V 2A 5TSMT
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17588 Pieces
- Data sheet:
- QSZ1TR.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 15V |
|---|---|
| Vce Saturation (Max) @ Ib, Ic: | 180mV @ 50mA, 1A |
| Transistor Type: | NPN, PNP (Emitter Coupled) |
| Supplier Device Package: | TSMT5 |
| Series: | - |
| Power - Max: | 500mW |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | SOT-23-5 Thin, TSOT-23-5 |
| Operating Temperature: | 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | QSZ1TR |
| Frequency - Transition: | 360MHz |
| Expanded Description: | Bipolar (BJT) Transistor Array NPN, PNP (Emitter Coupled) 15V 2A 360MHz 500mW Surface Mount TSMT5 |
| Description: | TRANS NPN/PNP 15V 2A 5TSMT |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 270 @ 200mA, 2V |
| Current - Collector Cutoff (Max): | 100nA (ICBO) |
| Current - Collector (Ic) (Max): | 2A |
| Email: | [email protected] |
Related parts for QSZ1TR
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
SMBT3904UPNE6327HTSA1 | Infineon Technologies | TRANS NPN/PNP 40V 0.2A SC74-6 | Inquiry |
 |
2N2652A | Central Semiconductor Corp | TRANS 2NPN 500MA 60V TO78-6 | Inquiry |
 |
CMXT2207 TR | Central Semiconductor Corp | TRANS NPN/PNP 600MA SOT26 | Inquiry |
 |
PMP5201Y,135 | Nexperia USA Inc. | TRANS 2PNP 45V 0.1A 6TSSOP | Inquiry |
|
HN1B01FDW1T1G | ON Semiconductor | TRANS NPN/PNP 50V 0.2A SC74 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers