BYCHIPS is the stocking distributor for PS21661-FR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for PS21661-FR by email, we will give you a best price according your plan.
Buy PS21661-FR with BYCHPS
Buy with guarantee
PS21661-FR
- Part Number:
- PS21661-FR
- Manufacturer:
- Powerex, Inc.
- Description:
- MOD IPM 600V 3A SIP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17559 Pieces
- Data sheet:
- PS21661-FR.pdf
Introduction
Specifications
| Voltage - Isolation: | 2500VDC |
|---|---|
| Voltage: | 600V |
| Type: | IGBT |
| Series: | Intellimod™ |
| Package / Case: | 35-PowerSIP Module, 29 Leads |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | PS21661-FR |
| Expanded Description: | Power Driver Module IGBT 3 Phase 600V 3A 35-PowerSIP Module, 29 Leads |
| Description: | MOD IPM 600V 3A SIP |
| Current: | 3A |
| Configuration: | 3 Phase |
| Email: | [email protected] |
Related parts for PS21661-FR
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
PS21661-RZ | Powerex Inc. | MOD IPM 600V 3A SIP | Inquiry |
 |
IRAM256-1067A | Infineon Technologies | IC MOD PWR HYBRID 600V 8A | Inquiry |
 |
IRAM336-025SB3 | Infineon Technologies | IC HYBRID MULTI-CHIP 500V 2A | Inquiry |
 |
IRAM538-1065A | Infineon Technologies | POWER DRIVER MOD 600V 10A LFRAME | Inquiry |
 |
PS21963-4 | Powerex Inc. | MOD IPM 600V 10A SUPERMINIDIP | Inquiry |
 |
IRAMX16UP60B | Infineon Technologies | IC PWR HYBRID 600V 16A SIP2 | Inquiry |
 |
FSB50250AB | Fairchild/ON Semiconductor | FET 3PH 500V 1.2A MODULE | Inquiry |
 |
PM300DSA120 | Powerex Inc. | MOD IPM DUAL 1200V 300A | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers