BYCHIPS is the stocking distributor for PP300D120, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for PP300D120 by email, we will give you a best price according your plan.
Buy PP300D120 with BYCHPS
Buy with guarantee
PP300D120
- Part Number:
- PP300D120
- Manufacturer:
- Powerex, Inc.
- Description:
- IGBT ASSY HBRIDGE 1200V 300A
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 15194 Pieces
- Data sheet:
- PP300D120.pdf
Introduction
Specifications
| Voltage - Isolation: | 2500VDC |
|---|---|
| Voltage: | 1200V |
| Type: | IGBT |
| Series: | POW-R-PAK™ |
| Package / Case: | Power Module |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | PP300D120 |
| Expanded Description: | Power Driver Module IGBT Half Bridge Inverter 1200V 300A Power Module |
| Description: | IGBT ASSY HBRIDGE 1200V 300A |
| Current: | 300A |
| Configuration: | Half Bridge Inverter |
| Email: | [email protected] |
Related parts for PP300D120
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
PP300D060 | Powerex Inc. | IGBT ASSY H-BRIDGE 600V 300A | Inquiry |
|
PP300B060 | Powerex Inc. | IGBT ASSY H-BRIDGE 600V 300A | Inquiry |
|
PP300T120 | Powerex Inc. | IGBT ASSEMBLY 3PHASE 1200V 300A | Inquiry |
|
PP300B120 | Powerex Inc. | IGBT ASSY 3-PHASE 1200V 300A | Inquiry |
 |
FNC42060F | Fairchild/ON Semiconductor | MODULE SPM 600V 20A SPMAA-A26 | Inquiry |
 |
FSAM30SH60A | Fairchild/ON Semiconductor | SMART POWER MODULE 30A SPM32-AA | Inquiry |
|
PP300T060 | Powerex Inc. | IGBT ASSEMBLY 3-PHASE 600V 300A | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers