BYCHIPS is the stocking distributor for PIC10LF322T-I/MC, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for PIC10LF322T-I/MC by email, we will give you a best price according your plan.
Buy PIC10LF322T-I/MC with BYCHPS
Buy with guarantee
PIC10LF322T-I/MC
- Part Number:
- PIC10LF322T-I/MC
- Manufacturer:
- Micrel / Microchip Technology
- Description:
- IC MCU 8BIT 896B FLASH 8DFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19415 Pieces
- Data sheet:
- 1.PIC10LF322T-I/MC.pdf2.PIC10LF322T-I/MC.pdf
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | 1.8 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 8-DFN (2x3) |
| Speed: | 16MHz |
| Series: | PIC® 10F |
| RAM Size: | 64 x 8 |
| Program Memory Type: | FLASH |
| Program Memory Size: | 896B (512 x 14) |
| Peripherals: | Brown-out Detect/Reset, POR, PWM, WDT |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 8-VFDFN Exposed Pad |
| Oscillator Type: | Internal |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of I/O: | 3 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | PIC10LF322T-I/MC |
| Expanded Description: | PIC PIC® 10F Microcontroller IC 8-Bit 16MHz 896B (512 x 14) FLASH 8-DFN (2x3) |
| EEPROM Size: | - |
| Description: | IC MCU 8BIT 896B FLASH 8DFN |
| Data Converters: | A/D 3x8b |
| Core Size: | 8-Bit |
| Core Processor: | PIC |
| Connectivity: | - |
| Email: | [email protected] |
Related parts for PIC10LF322T-I/MC
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers