BYCHIPS is the stocking distributor for PF48F3000P0ZTQEA, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for PF48F3000P0ZTQEA by email, we will give you a best price according your plan.
Buy PF48F3000P0ZTQEA with BYCHPS
Buy with guarantee
PF48F3000P0ZTQEA
- Part Number:
- PF48F3000P0ZTQEA
- Manufacturer:
- Micron Technology
- Description:
- IC FLASH 128MBIT 65NS 88SCSP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18043 Pieces
- Data sheet:
- PF48F3000P0ZTQEA.pdf
Introduction
Specifications
| Voltage - Supply: | 1.7 V ~ 2 V |
|---|---|
| Supplier Device Package: | 88-SCSP (8x10) |
| Speed: | 52MHz |
| Series: | Axcell™ |
| Packaging: | Tray |
| Package / Case: | 88-TFBGA, CSPBGA |
| Operating Temperature: | -40°C ~ 85°C (TC) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Memory Type: | Non-Volatile |
| Memory Size: | 128Mb (8M x 16) |
| Memory Format: | FLASH |
| Manufacturer Part Number: | PF48F3000P0ZTQEA |
| Interface: | Parallel |
| Description: | IC FLASH 128MBIT 65NS 88SCSP |
| Email: | [email protected] |
Related parts for PF48F3000P0ZTQEA
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
PF48F3000P0ZTQ0A | Micron Technology Inc. | IC FLASH 128MBIT 85NS 88SCSP | Inquiry |
|
PF48F3000P0ZBQ0A | Micron Technology Inc. | IC FLASH 128MBIT 85NS 88SCSP | Inquiry |
 |
PF48F4400P0VBQEJ | Micron Technology Inc. | IC FLASH 512MBIT 100NS 88SCSP | Inquiry |
 |
PF48F3000P0ZBQEA | Micron Technology Inc. | IC FLASH 128MBIT 65NS 88SCSP | Inquiry |
|
PF48F4400P0VBQE0 | Micron Technology Inc. | IC FLASH 512MBIT 100NS 88SCSP | Inquiry |
|
PF48F4000P0ZTQE3 | Micron Technology Inc. | IC FLASH 256MBIT 100NS 88SCSP | Inquiry |
|
PF48F4400P0VBQ2F TR | Micron Technology Inc. | IC FLASH 512MBIT 85NS 88SCSP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers