BYCHIPS is the stocking distributor for OPMNGSA005C, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for OPMNGSA005C by email, we will give you a best price according your plan.
Buy OPMNGSA005C with BYCHPS
Buy with guarantee
OPMNGSA005C
- Part Number:
- OPMNGSA005C
- Manufacturer:
- Bussmann (Eaton)
- Description:
- TERM BLK 63A DIN RAIL MNT
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12814 Pieces
- Data sheet:
- OPMNGSA005C.pdf
Introduction
Specifications
| Series: | OPTIMA® |
|---|---|
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | OPMNGSA005C |
| Description: | TERM BLK 63A DIN RAIL MNT |
| Email: | [email protected] |
Related parts for OPMNGSA005C
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CS00 | Eaton | TERMINAL COVER 160A NH00 | Inquiry |
|
OPMNGSA009 | Eaton | TERM BLOCK 63A OPM FUSE HLDR | Inquiry |
|
OPMNGSA472 | Eaton | COMB BAR 4POS 72MM OPM FUSE HLDR | Inquiry |
|
OPMNGSA010 | Eaton | COVER PROTECTIVE 3POS OPM MODULE | Inquiry |
|
OPMNGSA554 | Eaton | COMB BAR 5POS 54MM OPM FUSE HLDR | Inquiry |
|
OPMNGSA345 | Eaton | COMB BAR 3POS 45MM OPM FUSE HLDR | Inquiry |
|
OPMNGSA445 | Eaton | COMB BAR 4POS 45MM OPM FUSE HLDR | Inquiry |
|
OPMNGSA245 | Eaton | COMB BAR 2POS 45MM OPM FUSE HLDR | Inquiry |
|
OPMNGSA101 | Eaton | MARKING TABS OPM FUSE HOLDER | Inquiry |
|
OPMNGSA005 | Eaton | TERM BLOCK 63A OPM FUSE HLDR | Inquiry |
|
OPMNGSA254 | Eaton | COMB BAR 2POS 54MM OPM FUSE HLDR | Inquiry |
|
OPMNGSA454 | Eaton | COMB BAR 4POS 54MM OPM FUSE HLDR | Inquiry |
|
OPMNGSA272 | Eaton | COMB BAR 2POS 72MM OPM FUSE HLDR | Inquiry |
|
OPMNGSA354 | Eaton | COMB BAR 3POS 54MM OPM FUSE HLDR | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers