BYCHIPS is the stocking distributor for NVD5117PLT4G-VF01, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for NVD5117PLT4G-VF01 by email, we will give you a best price according your plan.
Buy NVD5117PLT4G-VF01 with BYCHPS
Buy with guarantee
NVD5117PLT4G-VF01
- Part Number:
- NVD5117PLT4G-VF01
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Description:
- MOSFET P-CH 60V 61A DPAK
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18400 Pieces
- Data sheet:
- NVD5117PLT4G-VF01.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 2.5V @ 250µA |
|---|---|
| Vgs (Max): | ±20V |
| Technology: | MOSFET (Metal Oxide) |
| Supplier Device Package: | DPAK-3 |
| Series: | - |
| Rds On (Max) @ Id, Vgs: | 16 mOhm @ 29A, 10V |
| Power Dissipation (Max): | 4.1W (Ta), 118W (Tc) |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Other Names: | NVD5117PLT4G NVD5117PLT4G-VF01TR NVD5117PLT4GOSTR NVD5117PLT4GOSTR-ND NVD6828NLT4G-VF01 |
| Operating Temperature: | -55°C ~ 175°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 19 Weeks |
| Manufacturer Part Number: | NVD5117PLT4G-VF01 |
| Input Capacitance (Ciss) (Max) @ Vds: | 4800pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | 85nC @ 10V |
| FET Type: | P-Channel |
| FET Feature: | - |
| Expanded Description: | P-Channel 60V 11A (Ta), 61A (Tc) 4.1W (Ta), 118W (Tc) Surface Mount DPAK-3 |
| Drive Voltage (Max Rds On, Min Rds On): | 4.5V, 10V |
| Drain to Source Voltage (Vdss): | 60V |
| Description: | MOSFET P-CH 60V 61A DPAK |
| Current - Continuous Drain (Id) @ 25°C: | 11A (Ta), 61A (Tc) |
| Email: | [email protected] |
Related parts for NVD5117PLT4G-VF01
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers