BYCHIPS is the stocking distributor for NRVBAF260T3G, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for NRVBAF260T3G by email, we will give you a best price according your plan.
Buy NRVBAF260T3G with BYCHPS
Buy with guarantee
NRVBAF260T3G
- Part Number:
- NRVBAF260T3G
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Description:
- DIODE SCHOTTKY 60V 2A SMA-FL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17717 Pieces
- Data sheet:
- NRVBAF260T3G.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 630mV @ 2A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 60V |
| Supplier Device Package: | SMA |
| Speed: | Fast Recovery = 200mA (Io) |
| Series: | Automotive, AEC-Q101 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | DO-214AC, SMA |
| Operating Temperature - Junction: | -55°C ~ 150°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 48 Weeks |
| Manufacturer Part Number: | NRVBAF260T3G |
| Expanded Description: | Diode Schottky 60V 2A Surface Mount SMA |
| Diode Type: | Schottky |
| Description: | DIODE SCHOTTKY 60V 2A SMA-FL |
| Current - Reverse Leakage @ Vr: | 200µA @ 60V |
| Current - Average Rectified (Io): | 2A |
| Capacitance @ Vr, F: | - |
| Email: | [email protected] |
Related parts for NRVBAF260T3G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers