BYCHIPS is the stocking distributor for NIS5135MN1-FN-7, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for NIS5135MN1-FN-7 by email, we will give you a best price according your plan.
Buy NIS5135MN1-FN-7 with BYCHPS
Buy with guarantee
NIS5135MN1-FN-7
- Part Number:
- NIS5135MN1-FN-7
- Manufacturer:
- Diodes Incorporated
- Description:
- IC LOAD SWITCH 10UDFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19300 Pieces
- Data sheet:
- 1.NIS5135MN1-FN-7.pdf2.NIS5135MN1-FN-7.pdf
Introduction
Specifications
| Voltage - Input: | 3.1 V ~ 18 V |
|---|---|
| Supplier Device Package: | U-DFN3030-10 |
| Series: | - |
| Sensing Method: | High-Side |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 10-UFDFN Exposed Pad |
| Other Names: | NIS5135MN1-FN-7DITR |
| Operating Temperature: | -40°C ~ 150°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | NIS5135MN1-FN-7 |
| Function: | Electronic Fuse |
| Expanded Description: | Electronic Fuse Regulator High-Side 3.6A U-DFN3030-10 |
| Description: | IC LOAD SWITCH 10UDFN |
| Current - Output: | 3.6A |
| Accuracy: | - |
| Email: | [email protected] |
Related parts for NIS5135MN1-FN-7
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
NIS5135MN2-FN-7 | Diodes Incorporated | IC LOAD SWITCH 10UDFN | Inquiry |
|
NIS5132MN2-FN-7 | Diodes Incorporated | IC LOAD SWITCH 12V 3.6A 10-UDFN | Inquiry |
 |
IXCP02M45A | IXYS | IC CURRENT REGULATOR TO220AB | Inquiry |
 |
MAX4210DEUA+T | Maxim Integrated | IC CURRENT MONITOR 1.5% 8MSOP | Inquiry |
|
NIS5132MN1-FN-7 | Diodes Incorporated | IC LOAD SWITCH 12V 3.6A 10-UDFN | Inquiry |
 |
LM3815MX-7.0 | Texas Instruments | IC CURRENT GAUGE 6% 8SOIC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers