BYCHIPS is the stocking distributor for NCV330MUTBG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for NCV330MUTBG by email, we will give you a best price according your plan.
Buy NCV330MUTBG with BYCHPS
Buy with guarantee
NCV330MUTBG
- Part Number:
- NCV330MUTBG
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Description:
- IC LOAD SWITCH 3A SOFT ST 4UDFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14886 Pieces
- Data sheet:
- NCV330MUTBG.pdf
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | - |
|---|---|
| Voltage - Load: | 1.8 V ~ 5.5 V |
| Switch Type: | General Purpose |
| Supplier Device Package: | 4-UDFN (1.2x1.6) |
| Series: | - |
| Rds On (Typ): | 26 mOhm |
| Ratio - Input:Output: | 1:1 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 4-UFDFN Exposed Pad |
| Output Type: | N-Channel |
| Output Configuration: | High Side |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of Outputs: | 1 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 4 Weeks |
| Manufacturer Part Number: | NCV330MUTBG |
| Interface: | On/Off |
| Input Type: | - |
| Features: | Slew Rate Controlled |
| Fault Protection: | - |
| Description: | IC LOAD SWITCH 3A SOFT ST 4UDFN |
| Current - Output (Max): | 3A |
| Email: | [email protected] |
Related parts for NCV330MUTBG
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers