BYCHIPS is the stocking distributor for MRF6S23100HSR5, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MRF6S23100HSR5 by email, we will give you a best price according your plan.
Buy MRF6S23100HSR5 with BYCHPS
Buy with guarantee
MRF6S23100HSR5
- Part Number:
- MRF6S23100HSR5
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- FET RF 68V 2.4GHZ NI-780S
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18991 Pieces
- Data sheet:
- MRF6S23100HSR5.pdf
Introduction
Specifications
| Voltage - Test: | 28V |
|---|---|
| Voltage - Rated: | 68V |
| Transistor Type: | LDMOS |
| Supplier Device Package: | NI-780S |
| Series: | - |
| Power - Output: | 20W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | NI-780S |
| Noise Figure: | - |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | MRF6S23100HSR5 |
| Gain: | 15.4dB |
| Frequency: | 2.4GHz |
| Expanded Description: | RF Mosfet LDMOS 28V 1A 2.4GHz 15.4dB 20W NI-780S |
| Description: | FET RF 68V 2.4GHZ NI-780S |
| Current Rating: | - |
| Current - Test: | 1A |
| Email: | [email protected] |
Related parts for MRF6S23100HSR5
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MRF6S23100HR5 | NXP USA Inc. | FET RF 68V 2.4GHZ NI-780 | Inquiry |
 |
MRF6S23140HSR3 | NXP USA Inc. | FET RF 68V 2.39GHZ NI-880S | Inquiry |
|
MRF6S23100HSR3 | NXP USA Inc. | FET RF 68V 2.4GHZ NI-780S | Inquiry |
|
MRF6S23140HSR5 | NXP USA Inc. | FET RF 68V 2.39GHZ NI-880S | Inquiry |
 |
MRF6S23140HR5 | NXP USA Inc. | FET RF 68V 2.39GHZ NI-880 | Inquiry |
|
MRF6S23100HR3 | NXP USA Inc. | FET RF 68V 2.4GHZ NI-780 | Inquiry |
|
MRF6S23140HR3 | NXP USA Inc. | FET RF 68V 2.39GHZ NI-880 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers