BYCHIPS is the stocking distributor for MK66FN2M0VMD18, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MK66FN2M0VMD18 by email, we will give you a best price according your plan.
Buy MK66FN2M0VMD18 with BYCHPS
Buy with guarantee
MK66FN2M0VMD18
- Part Number:
- MK66FN2M0VMD18
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC MCU 32BIT 2MB FLASH 144BGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14278 Pieces
- Data sheet:
- MK66FN2M0VMD18.pdf
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | 1.71 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 144-PBGA (13x13) |
| Speed: | 180MHz |
| Series: | Kinetis K60 |
| RAM Size: | 256K x 8 |
| Program Memory Type: | FLASH |
| Program Memory Size: | 2MB (2M x 8) |
| Peripherals: | DMA, I²S, LVD, POR, PWM, WDT |
| Packaging: | Tray |
| Package / Case: | 144-LFBGA |
| Other Names: | 935323716557 |
| Oscillator Type: | Internal |
| Operating Temperature: | -40°C ~ 105°C (TA) |
| Number of I/O: | 100 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | MK66FN2M0VMD18 |
| Expanded Description: | ARM® Cortex®-M4 Kinetis K60 Microcontroller IC 32-Bit 180MHz 2MB (2M x 8) FLASH 144-PBGA (13x13) |
| EEPROM Size: | - |
| Description: | IC MCU 32BIT 2MB FLASH 144BGA |
| Data Converters: | A/D 2x16b, D/A 2x12b |
| Core Size: | 32-Bit |
| Core Processor: | ARM® Cortex®-M4 |
| Connectivity: | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG |
| Email: | [email protected] |
Related parts for MK66FN2M0VMD18
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers