BYCHIPS is the stocking distributor for MH4532-700Y, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MH4532-700Y by email, we will give you a best price according your plan.
Buy MH4532-700Y with BYCHPS
Buy with guarantee
MH4532-700Y
- Part Number:
- MH4532-700Y
- Manufacturer:
- Bourns, Inc.
- Description:
- FERRITE BEAD 70 OHM 1812 1LN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12669 Pieces
- Data sheet:
- MH4532-700Y.pdf
Introduction
Specifications
| Size / Dimension: | 0.177" L x 0.126" W (4.50mm x 3.20mm) |
|---|---|
| Series: | MH |
| Ratings: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1812 (4532 Metric) |
| Other Names: | MH4532-700Y-ND MH4532-700YTR MH4532700Y |
| Operating Temperature: | -55°C ~ 125°C |
| Number of Lines: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | MH4532-700Y |
| Impedance @ Frequency: | 70 Ohm @ 100MHz |
| Height (Max): | 0.067" (1.70mm) |
| Filter Type: | Power, Signal Line |
| Description: | FERRITE BEAD 70 OHM 1812 1LN |
| DC Resistance (DCR) (Max): | 30 mOhm |
| Current Rating (Max): | 6A |
| Email: | [email protected] |
Related parts for MH4532-700Y
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers