BYCHIPS is the stocking distributor for MCR10EZHF3830, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MCR10EZHF3830 by email, we will give you a best price according your plan.
Buy MCR10EZHF3830 with BYCHPS
Buy with guarantee
MCR10EZHF3830
- Part Number:
- MCR10EZHF3830
- Manufacturer:
- LAPIS Semiconductor
- Description:
- RES SMD 383 OHM 1% 1/8W 0805
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14526 Pieces
- Data sheet:
- MCR10EZHF3830.pdf
Introduction
Specifications
| Tolerance: | ±1% |
|---|---|
| Temperature Coefficient: | ±100ppm/°C |
| Supplier Device Package: | 0805 |
| Size / Dimension: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Series: | MCR |
| Resistance (Ohms): | 383 |
| Power (Watts): | 0.125W, 1/8W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0805 (2012 Metric) |
| Other Names: | RHM383CTR |
| Operating Temperature: | -55°C ~ 155°C |
| Number of Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | MCR10EZHF3830 |
| Height - Seated (Max): | 0.026" (0.65mm) |
| Features: | - |
| Failure Rate: | - |
| Expanded Description: | 383 Ohm ±1% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Thick Film |
| Description: | RES SMD 383 OHM 1% 1/8W 0805 |
| Composition: | Thick Film |
| Email: | [email protected] |
Related parts for MCR10EZHF3830
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers