BYCHIPS is the stocking distributor for MCP23S09-E/MG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MCP23S09-E/MG by email, we will give you a best price according your plan.
Buy MCP23S09-E/MG with BYCHPS
Buy with guarantee
MCP23S09-E/MG
- Part Number:
- MCP23S09-E/MG
- Manufacturer:
- Micrel / Microchip Technology
- Description:
- IC I/O EXPANDER SPI 8B 16QFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17322 Pieces
- Data sheet:
- MCP23S09-E/MG.pdf
Introduction
Specifications
| Voltage - Supply: | 1.8 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 16-QFN-EP (3x3) |
| Series: | - |
| Packaging: | Tube |
| Package / Case: | 16-VFQFN Exposed Pad |
| Output Type: | Open Drain |
| Other Names: | MCP23S09EMG |
| Operating Temperature: | -40°C ~ 125°C |
| Number of I/O: | 8 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 5 Weeks |
| Manufacturer Part Number: | MCP23S09-E/MG |
| Interrupt Output: | Yes |
| Interface: | SPI |
| Features: | - |
| Expanded Description: | I/O Expander 8 SPI 16-QFN-EP (3x3) |
| Description: | IC I/O EXPANDER SPI 8B 16QFN |
| Current - Output Source/Sink: | 25mA |
| Clock Frequency: | 10MHz |
| Email: | [email protected] |
Related parts for MCP23S09-E/MG
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers