BYCHIPS is the stocking distributor for MB9BF364LQN-G-AVE2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MB9BF364LQN-G-AVE2 by email, we will give you a best price according your plan.
Buy MB9BF364LQN-G-AVE2 with BYCHPS
Buy with guarantee
MB9BF364LQN-G-AVE2
- Part Number:
- MB9BF364LQN-G-AVE2
- Manufacturer:
- Cypress Semiconductor
- Description:
- IC MCU 32BIT 288KB FLASH 64QFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14263 Pieces
- Data sheet:
- MB9BF364LQN-G-AVE2.pdf
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | 2.7 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 64-QFN (9x9) |
| Speed: | 160MHz |
| Series: | FM4 MB9B360L |
| RAM Size: | 32K x 8 |
| Program Memory Type: | FLASH |
| Program Memory Size: | 288KB (288K x 8) |
| Peripherals: | DMA, LVD, POR, PWM, WDT |
| Packaging: | Tray |
| Package / Case: | 64-VFQFN Exposed Pad |
| Oscillator Type: | Internal |
| Operating Temperature: | -40°C ~ 125°C (TA) |
| Number of I/O: | 48 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | MB9BF364LQN-G-AVE2 |
| Expanded Description: | ARM® Cortex®-M4F FM4 MB9B360L Microcontroller IC 32-Bit 160MHz 288KB (288K x 8) FLASH 64-QFN (9x9) |
| EEPROM Size: | - |
| Description: | IC MCU 32BIT 288KB FLASH 64QFN |
| Data Converters: | A/D 15x12b, A/D 2x10b |
| Core Size: | 32-Bit |
| Core Processor: | ARM® Cortex®-M4F |
| Connectivity: | CSIO, I²C, LIN, UART/USART, USB |
| Email: | [email protected] |
Related parts for MB9BF364LQN-G-AVE2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers