BYCHIPS is the stocking distributor for MB9AFAA2MPMC1-G-SNE2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MB9AFAA2MPMC1-G-SNE2 by email, we will give you a best price according your plan.
Buy MB9AFAA2MPMC1-G-SNE2 with BYCHPS
Buy with guarantee
MB9AFAA2MPMC1-G-SNE2
- Part Number:
- MB9AFAA2MPMC1-G-SNE2
- Manufacturer:
- Cypress Semiconductor
- Description:
- IC MCU 32BIT 128KB FLASH 80LQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15875 Pieces
- Data sheet:
- MB9AFAA2MPMC1-G-SNE2.pdf
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | 1.8 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 80-LQFP (14x14) |
| Speed: | 20MHz |
| Series: | FM3 MB9AAA0N |
| RAM Size: | 16K x 8 |
| Program Memory Type: | FLASH |
| Program Memory Size: | 128KB (128K x 8) |
| Peripherals: | LCD, LVD, POR, PWM, WDT |
| Packaging: | Tray |
| Package / Case: | 80-LQFP |
| Oscillator Type: | Internal |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of I/O: | 67 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | MB9AFAA2MPMC1-G-SNE2 |
| Expanded Description: | ARM® Cortex®-M3 FM3 MB9AAA0N Microcontroller IC 32-Bit 20MHz 128KB (128K x 8) FLASH 80-LQFP (14x14) |
| EEPROM Size: | - |
| Description: | IC MCU 32BIT 128KB FLASH 80LQFP |
| Data Converters: | A/D 12x12b, D/A 2x10b |
| Core Size: | 32-Bit |
| Core Processor: | ARM® Cortex®-M3 |
| Connectivity: | CSIO, I²C, UART/USART |
| Email: | [email protected] |
Related parts for MB9AFAA2MPMC1-G-SNE2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers