BYCHIPS is the stocking distributor for MAX13035EEBE+T, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MAX13035EEBE+T by email, we will give you a best price according your plan.
Buy MAX13035EEBE+T with BYCHPS
Buy with guarantee
MAX13035EEBE+T
- Part Number:
- MAX13035EEBE+T
- Manufacturer:
- Maxim Integrated
- Description:
- IC TRANSL LOGIC 16-UCSP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13179 Pieces
- Data sheet:
- 1.MAX13035EEBE+T.pdf2.MAX13035EEBE+T.pdf
Introduction
Specifications
| Voltage - VCCB: | 2.2 V ~ 3.6 V |
|---|---|
| Voltage - VCCA: | 1.62 V ~ 3.2 V |
| Translator Type: | Voltage Level |
| Supplier Device Package: | 16-UCSP (4x4) |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 16-WFBGA, CSPBGA |
| Output Type: | Open Drain, Push-Pull |
| Output Signal: | - |
| Other Names: | MAX13035EEBE+ MAX13035EEBE+TTR MAX13035EEBE+TTR-ND |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | MAX13035EEBE+T |
| Input Signal: | - |
| Features: | Power Supply Decoupling |
| Expanded Description: | Voltage Level Translator Bidirectional 1 Circuit 6 Channel 100Mbps 16-UCSP (4x4) |
| Description: | IC TRANSL LOGIC 16-UCSP |
| Data Rate: | 100Mbps |
| Channels per Circuit: | 6 |
| Channel Type: | Bidirectional |
| Email: | [email protected] |
Related parts for MAX13035EEBE+T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers