BYCHIPS is the stocking distributor for MAL218197001E3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MAL218197001E3 by email, we will give you a best price according your plan.
Buy MAL218197001E3 with BYCHPS
Buy with guarantee
MAL218197001E3
- Part Number:
- MAL218197001E3
- Manufacturer:
- Angstrohm / Vishay
- Description:
- CAP ALUM POLY 18UF 20% 35V SMD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12816 Pieces
Introduction
Specifications
| Voltage Rating: | 35V |
|---|---|
| Type: | Polymer |
| Tolerance: | ±20% |
| Surface Mount Land Size: | 0.260" L x 0.260" W (6.60mm x 6.60mm) |
| Size / Dimension: | 0.248" Dia (6.30mm) |
| Series: | 181 CPL |
| Ripple Current - Low Frequency: | - |
| Ripple Current - High Frequency: | 900mA @ 100kHz |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Radial, Can - SMD |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 9 Weeks |
| Manufacturer Part Number: | MAL218197001E3 |
| Lifetime @ Temp.: | 5000 Hrs @ 105°C |
| Lead Spacing: | - |
| Impedance: | 64 mOhm |
| Height - Seated (Max): | 0.232" (5.90mm) |
| Expanded Description: | 18µF ±20% 35V Aluminum Polymer Capacitor Radial, Can - SMD 5000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | - |
| Description: | CAP ALUM POLY 18UF 20% 35V SMD |
| Capacitance: | 18µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for MAL218197001E3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers