BYCHIPS is the stocking distributor for M86261G12, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for M86261G12 by email, we will give you a best price according your plan.
Buy M86261G12 with BYCHPS
Buy with guarantee
M86261G12
- Part Number:
- M86261G12
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC C2K 650MHZ 8CH VOIP 625BGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16752 Pieces
- Data sheet:
- M86261G12.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Other Names: | 935325894557 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | M86261G12 |
| Expanded Description: | Telecom IC |
| Description: | IC C2K 650MHZ 8CH VOIP 625BGA |
| Email: | [email protected] |
Related parts for M86261G12
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
LE58QL031DJC | Microsemi Corporation | IC CODEC/FILTER 4CH 8I/O 32PLCC | Inquiry |
|
ZL49031DDE1 | Microsemi Corporation | IC RECEIVER DTMF 16PAIR 20SSOP | Inquiry |
 |
SI3018-GS | Silicon Labs | IC ISOMODEM LINE-SIDE DAA 16SOIC | Inquiry |
 |
TS122 | IXYS Integrated Circuits Division | IC RELAY OPTO 150MA 8DIP | Inquiry |
 |
PSB 6972 HL V1.3 | Infineon Technologies | IC SW CTRLR TANTOS-2G LQFP-100 | Inquiry |
 |
PEF 22554 E V3.1 | Infineon Technologies | IC LIU E1/T1/J1 160LBGA | Inquiry |
|
SI3210-FTR | Silicon Labs | IC SLIC/CODEC PROGRAMMBL 38TSSOP | Inquiry |
 |
M86262G12 | NXP USA Inc. | IC C2K 650MHZ 8CH VOIP 625BGA | Inquiry |
|
MT8967ASR1 | Microsemi Corporation | IC CODEC A-LAW CCITT PCM 20SOIC | Inquiry |
 |
78P2352-IEL/F | Maxim Integrated | IC LIU SDH SONET 2CH 128-LQFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers