BYCHIPS is the stocking distributor for M74HCT367RM13TR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for M74HCT367RM13TR by email, we will give you a best price according your plan.
Buy M74HCT367RM13TR with BYCHPS
Buy with guarantee
M74HCT367RM13TR
- Part Number:
- M74HCT367RM13TR
- Manufacturer:
- ST
- Description:
- IC BUS BUFF TRI-ST HEX 16SOIC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12737 Pieces
- Data sheet:
- M74HCT367RM13TR.pdf
Introduction
Specifications
| Voltage - Supply: | 4.5 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 16-SO |
| Series: | 74HCT |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 16-SOIC (0.154", 3.90mm Width) |
| Output Type: | Push-Pull |
| Other Names: | 497-4278-2 |
| Operating Temperature: | -55°C ~ 125°C (TA) |
| Number of Elements: | 2 |
| Number of Bits per Element: | 2, 4 (Hex) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | M74HCT367RM13TR |
| Logic Type: | Buffer, Non-Inverting |
| Input Type: | - |
| Expanded Description: | Buffer, Non-Inverting Element 2, 4 (Hex) Bit per Element Push-Pull Output 16-SO |
| Description: | IC BUS BUFF TRI-ST HEX 16SOIC |
| Current - Output High, Low: | 6mA, 6mA |
| Email: | [email protected] |
Related parts for M74HCT367RM13TR
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers