BYCHIPS is the stocking distributor for LH28F320S3HNS-ZM, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for LH28F320S3HNS-ZM by email, we will give you a best price according your plan.
Buy LH28F320S3HNS-ZM with BYCHPS
Buy with guarantee
LH28F320S3HNS-ZM
- Part Number:
- LH28F320S3HNS-ZM
- Manufacturer:
- Sharp Microelectronics
- Description:
- IC FLASH 32MBIT 110NS 56SSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17768 Pieces
- Data sheet:
- LH28F320S3HNS-ZM.pdf
Introduction
Specifications
| Voltage - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 56-SSOP |
| Speed: | 110ns |
| Series: | - |
| Packaging: | Tray |
| Package / Case: | 56-SOP (0.524", 13.30mm) |
| Other Names: | 425-2462 LHF32KZM |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Memory Type: | Non-Volatile |
| Memory Size: | 32Mb (4M x 8, 2M x 16) |
| Memory Format: | FLASH |
| Manufacturer Part Number: | LH28F320S3HNS-ZM |
| Interface: | Parallel |
| Description: | IC FLASH 32MBIT 110NS 56SSOP |
| Email: | [email protected] |
Related parts for LH28F320S3HNS-ZM
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
LH28F320SKTD-ZR | Sharp Microelectronics | IC FLASH 32MBIT 70NS 48TSOP | Inquiry |
|
LH28F320S3HNS-L11 | Sharp Microelectronics | IC FLASH 32MBIT 110NS 56SSOP | Inquiry |
|
LH28F320BJE-PBTL90 | Sharp Microelectronics | IC FLASH 32MBIT 90NS 48TSOP | Inquiry |
 |
LH28F320SKTD-L70 | Sharp Microelectronics | IC FLASH 32MBIT 70NS 56TSOP | Inquiry |
 |
LH28F320S3NS-L11 | Sharp Microelectronics | IC FLASH 32MBIT 110NS 56SSOP | Inquiry |
|
LH28F320S5NS-L90 | Sharp Microelectronics | IC FLASH 32MBIT 90NS 56SSOP | Inquiry |
|
LH28F320S5HNS-L90 | Sharp Microelectronics | IC FLASH 32MBIT 90NS 56SSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers