BYCHIPS is the stocking distributor for LDS9003-002-T2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for LDS9003-002-T2 by email, we will give you a best price according your plan.
Buy LDS9003-002-T2 with BYCHPS
Buy with guarantee
LDS9003-002-T2
- Part Number:
- LDS9003-002-T2
- Manufacturer:
- IXYS Corporation
- Description:
- IC TEMP/PWM CONTROLLER 16WQFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19323 Pieces
- Data sheet:
- LDS9003-002-T2.pdf
Introduction
Specifications
| Voltage - Supply: | 2.5 V ~ 5.5 V |
|---|---|
| Topology: | ADC, Oscillator, Register Bank |
| Supplier Device Package: | 16-TQFN (3x3) |
| Series: | - |
| Sensor Type: | External |
| Sensing Temperature: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 16-WFQFN Exposed Pad |
| Output Type: | I²C |
| Output Fan: | No |
| Output Alarm: | No |
| Other Names: | LDS9003-002-T2-2 LDS9003002T2 |
| Operating Temperature: | -40°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | LDS9003-002-T2 |
| Function: | Temp Monitoring System (Sensor) |
| Expanded Description: | Temp Monitoring System (Sensor) External Sensor I²C Output 16-TQFN (3x3) |
| Description: | IC TEMP/PWM CONTROLLER 16WQFN |
| Accuracy: | - |
| Email: | [email protected] |
Related parts for LDS9003-002-T2
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MCP98242T-BE/MUY | Microchip Technology | IC TEMP SENSOR 2WIRE 8-UDFN | Inquiry |
 |
MAX6616AEG+ | Maxim Integrated | IC TEMP MON FAN CNTRL 24QSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers