BYCHIPS is the stocking distributor for IXGP30N60B4D1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for IXGP30N60B4D1 by email, we will give you a best price according your plan.
Buy IXGP30N60B4D1 with BYCHPS
Buy with guarantee
IXGP30N60B4D1
- Part Number:
- IXGP30N60B4D1
- Manufacturer:
- IXYS Corporation
- Description:
- IGBT 600V 56A 190W TO220
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14699 Pieces
- Data sheet:
- IXGP30N60B4D1.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 600V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 1.7V @ 15V, 24A |
| Test Condition: | 400V, 24A, 10 Ohm, 15V |
| Td (on/off) @ 25°C: | 21ns/200ns |
| Switching Energy: | 440µJ (on), 700µJ (off) |
| Supplier Device Package: | TO-220AB |
| Series: | - |
| Reverse Recovery Time (trr): | 30ns |
| Power - Max: | 190W |
| Packaging: | Tube |
| Package / Case: | TO-220-3 |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | IXGP30N60B4D1 |
| Input Type: | Standard |
| IGBT Type: | PT |
| Gate Charge: | 77nC |
| Expanded Description: | IGBT PT 600V 56A 190W Through Hole TO-220AB |
| Description: | IGBT 600V 56A 190W TO220 |
| Current - Collector Pulsed (Icm): | 156A |
| Current - Collector (Ic) (Max): | 56A |
| Email: | [email protected] |
Related parts for IXGP30N60B4D1
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
IXGP30N120B3 | IXYS | IGBT 1200V 60A 300W TO220 | Inquiry |
|
IXGP30N60B2 | IXYS | IGBT 600V 70A 190W TO220 | Inquiry |
|
IXGP30N60C3C1 | IXYS | IGBT 600V 60A 220W TO220 | Inquiry |
|
IXGP30N60C2 | IXYS | IGBT 600V 70A 190W TO220 | Inquiry |
|
IXGP30N60C3D4 | IXYS | IGBT 600V 60A 220W TO220AB | Inquiry |
|
IXGP30N60C3 | IXYS | IGBT 600V 60A 220W TO220AB | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers