BYCHIPS is the stocking distributor for IXA20PG1200DHGLB, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for IXA20PG1200DHGLB by email, we will give you a best price according your plan.
Buy IXA20PG1200DHGLB with BYCHPS
Buy with guarantee
IXA20PG1200DHGLB
- Part Number:
- IXA20PG1200DHGLB
- Manufacturer:
- IXYS Corporation
- Description:
- IGBT MODULE 1200V 105A SMPD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16816 Pieces
- Data sheet:
- IXA20PG1200DHGLB.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 1200V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 2.1V @ 15V, 15A |
| Supplier Device Package: | ISOPLUS-SMPD™.B |
| Series: | - |
| Power - Max: | 130W |
| Package / Case: | 9-SMD Module |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| NTC Thermistor: | No |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | IXA20PG1200DHGLB |
| Input Capacitance (Cies) @ Vce: | - |
| Input: | Standard |
| IGBT Type: | PT |
| Expanded Description: | IGBT Array PT Half Bridge 1200V 32A 130W Surface Mount ISOPLUS-SMPD™.B |
| Description: | IGBT MODULE 1200V 105A SMPD |
| Current - Collector Cutoff (Max): | 125µA |
| Current - Collector (Ic) (Max): | 32A |
| Configuration: | Half Bridge |
| Email: | [email protected] |
Related parts for IXA20PG1200DHGLB
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
IXA20PG1200DHGLB-TRR | IXYS | IGBT MODULE 1200V 105A SMPD | Inquiry |
|
IXA20RG1200DHGLB | IXYS | IGBT 1200V 32A 125W SMPD | Inquiry |
 |
IXA20I1200PB | IXYS | IGBT 1200V 33A 130W TO220 | Inquiry |
 |
IXA20IF1200HB | IXYS | IGBT 1200V 38A 165W TO247 | Inquiry |
|
IXA20RG1200DHGLB-TRR | IXYS | IGBT 1200V 32A 125W SMPD | Inquiry |
 |
FII40-06D | IXYS | IGBT 600V 40A I-PACK | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers