BYCHIPS is the stocking distributor for HHXC250ARA271MJA0G, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HHXC250ARA271MJA0G by email, we will give you a best price according your plan.
Buy HHXC250ARA271MJA0G with BYCHPS
Buy with guarantee
HHXC250ARA271MJA0G
- Part Number:
- HHXC250ARA271MJA0G
- Manufacturer:
- Nippon Chemi-Con
- Description:
- CONDUCTIVE POLYMER HYBRID ALUMIN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17641 Pieces
- Data sheet:
- HHXC250ARA271MJA0G.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | HHXC250ARA271MJA0G |
| Expanded Description: | Aluminum Polymer Capacitor |
| Description: | CONDUCTIVE POLYMER HYBRID ALUMIN |
| Email: | [email protected] |
Related parts for HHXC250ARA271MJA0G
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
HHXC250ARA680MF80G | United Chemi-Con | CAP ALUM POLY 68UF 25V SNAP-IN | Inquiry |
|
HHXC250ARA151MHA0G | United Chemi-Con | CAP ALUM POLY 150UF 25V SNAP-IN | Inquiry |
|
HHXC250ARA560MF61G | United Chemi-Con | CAP ALUM POLY 56UF 25V SNAP-IN | Inquiry |
|
HHXC250ARA330ME61G | United Chemi-Con | CAP ALUM POLY 33UF 25V SNAP-IN | Inquiry |
|
HHXC250ARA470MF61G | United Chemi-Con | CAP ALUM POLY 47UF 25V SNAP-IN | Inquiry |
|
HHXC250ARA331MJA0G | United Chemi-Con | CAP ALUM POLY 330UF 25V SNAP-IN | Inquiry |
|
HHXC250ARA221MHA0G | United Chemi-Con | CAP ALUM POLY 220UF 25V SNAP-IN | Inquiry |
|
HHXC250ARA101MF80G | United Chemi-Con | CAP ALUM POLY 100UF 25V SNAP-IN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers