BYCHIPS is the stocking distributor for HGT1S10N120BNST, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HGT1S10N120BNST by email, we will give you a best price according your plan.
Buy HGT1S10N120BNST with BYCHPS
Buy with guarantee
HGT1S10N120BNST
- Part Number:
- HGT1S10N120BNST
- Manufacturer:
- Fairchild/ON Semiconductor
- Description:
- IGBT 1200V 35A 298W TO263AB
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15141 Pieces
- Data sheet:
- HGT1S10N120BNST.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 1200V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 2.7V @ 15V, 10A |
| Test Condition: | 960V, 10A, 10 Ohm, 15V |
| Td (on/off) @ 25°C: | 23ns/165ns |
| Switching Energy: | 320µJ (on), 800µJ (off) |
| Supplier Device Package: | TO-263AB |
| Series: | - |
| Power - Max: | 298W |
| Packaging: | Original-Reel® |
| Package / Case: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Other Names: | HGT1S10N120BNSTDKR |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 11 Weeks |
| Manufacturer Part Number: | HGT1S10N120BNST |
| Input Type: | Standard |
| IGBT Type: | NPT |
| Gate Charge: | 100nC |
| Expanded Description: | IGBT NPT 1200V 35A 298W Surface Mount TO-263AB |
| Description: | IGBT 1200V 35A 298W TO263AB |
| Current - Collector Pulsed (Icm): | 80A |
| Current - Collector (Ic) (Max): | 35A |
| Email: | [email protected] |
Related parts for HGT1S10N120BNST
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers