BYCHIPS is the stocking distributor for FSBM30SH60A, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FSBM30SH60A by email, we will give you a best price according your plan.
Buy FSBM30SH60A with BYCHPS
Buy with guarantee
FSBM30SH60A
- Part Number:
- FSBM30SH60A
- Manufacturer:
- Fairchild/ON Semiconductor
- Description:
- SMART POWER MODULE 30A SPM32-AA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14565 Pieces
- Data sheet:
- FSBM30SH60A.pdf
Introduction
Specifications
| Voltage - Isolation: | 2500Vrms |
|---|---|
| Voltage: | 600V |
| Type: | IGBT |
| Series: | SPM® |
| Package / Case: | 32-PowerDIP Module (1.370", 34.80mm) |
| Other Names: | FSBM30SH60A_NL FSBM30SH60A_NL-ND |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | FSBM30SH60A |
| Expanded Description: | Power Driver Module IGBT 3 Phase 600V 30A 32-PowerDIP Module (1.370", 34.80mm) |
| Description: | SMART POWER MODULE 30A SPM32-AA |
| Current: | 30A |
| Configuration: | 3 Phase |
| Email: | [email protected] |
Related parts for FSBM30SH60A
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FSBB15CH60B | Fairchild/ON Semiconductor | MODULE SPM 600V 15A 3PH SPM27CC | Inquiry |
 |
FSBM30SM60A | Fairchild/ON Semiconductor | SMART POWER MODULE 30A SPM32-AA | Inquiry |
 |
PM50CL1A060 | Powerex Inc. | MOD IPM 6-PAC L1 50A 600V | Inquiry |
|
PP100B060 | Powerex Inc. | IGBT ASSEMBLY HBRIDGE 600V 100A | Inquiry |
|
PM75B5LA060 | Powerex Inc. | MOD IPM L-SERIES 600V 75A | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers