BYCHIPS is the stocking distributor for FSB50250US, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FSB50250US by email, we will give you a best price according your plan.
Buy FSB50250US with BYCHPS
Buy with guarantee
FSB50250US
- Part Number:
- FSB50250US
- Manufacturer:
- Fairchild/ON Semiconductor
- Description:
- MODULE SPM 500V 1.1A SPM23BD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19096 Pieces
- Data sheet:
- FSB50250US.pdf
Introduction
Specifications
| Voltage - Isolation: | 1500Vrms |
|---|---|
| Voltage: | 500V |
| Type: | MOSFET |
| Series: | Motion-SPM® |
| Package / Case: | 23-PowerSMD Module, Gull Wing |
| Other Names: | FSB50250USDKR |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | FSB50250US |
| Expanded Description: | Power Driver Module MOSFET 3 Phase 500V 1.1A 23-PowerSMD Module, Gull Wing |
| Description: | MODULE SPM 500V 1.1A SPM23BD |
| Current: | 1.1A |
| Configuration: | 3 Phase |
| Email: | [email protected] |
Related parts for FSB50250US
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FSB50250UTD | Fairchild/ON Semiconductor | MOD SPM 500V 1.1A SPM23-ED | Inquiry |
 |
FSB50250AT | Fairchild/ON Semiconductor | MODULE SPM 500V 1.2A SPM5N | Inquiry |
 |
FSB50250A | Fairchild/ON Semiconductor | MODULE SPM 500V 1.2A SPM5P | Inquiry |
 |
FSB50250AB | Fairchild/ON Semiconductor | FET 3PH 500V 1.2A MODULE | Inquiry |
 |
FSB50250AS | Fairchild/ON Semiconductor | MODULE SPM 500V 1.2A SPM5Q | Inquiry |
 |
FSB50250 | Fairchild/ON Semiconductor | IC SMART POWER MOD 2A SPM23-AA | Inquiry |
 |
FSB50250UD | Fairchild/ON Semiconductor | MOD SPM 500V 1.1A SPM23-HD | Inquiry |
 |
FSB50250S | Fairchild/ON Semiconductor | IC SMART POWER MOD 2A SPM23-BA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers