BYCHIPS is the stocking distributor for FCN2416H184J, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FCN2416H184J by email, we will give you a best price according your plan.
Buy FCN2416H184J with BYCHPS
Buy with guarantee
FCN2416H184J
- Part Number:
- FCN2416H184J
- Manufacturer:
- Cornell Dubilier Electronics
- Description:
- CAP FILM 0.18UF 5% 50VDC 2416
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17793 Pieces
- Data sheet:
- FCN2416H184J.pdf
Introduction
Specifications
| Voltage Rating - DC: | 50V |
|---|---|
| Voltage Rating - AC: | 40V |
| Tolerance: | ±5% |
| Termination: | Solder Pads |
| Size / Dimension: | 0.236" L x 0.161" W (6.00mm x 4.10mm) |
| Series: | FCN |
| Packaging: | Bulk |
| Package / Case: | 2416 (6041 Metric) |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | FCN2416H184J |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.102" (2.60mm) |
| Features: | - |
| Expanded Description: | 0.18µF ±5% Film Capacitor 40V 50V Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked 2416 (6041 Metric) |
| ESR (Equivalent Series Resistance): | - |
| Dielectric Material: | Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked |
| Description: | CAP FILM 0.18UF 5% 50VDC 2416 |
| Capacitance: | 0.18µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for FCN2416H184J
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers