BYCHIPS is the stocking distributor for ERHA551LGC392MEE0M, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ERHA551LGC392MEE0M by email, we will give you a best price according your plan.
Buy ERHA551LGC392MEE0M with BYCHPS
Buy with guarantee
ERHA551LGC392MEE0M
- Part Number:
- ERHA551LGC392MEE0M
- Manufacturer:
- Nippon Chemi-Con
- Description:
- CAP ALUM 3900UF 20% 550V SCREW
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12806 Pieces
- Data sheet:
- ERHA551LGC392MEE0M.pdf
Introduction
Specifications
| Voltage Rating: | 550V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 3.000" Dia (76.20mm) |
| Series: | FPCAP, RHA |
| Ripple Current: | 15.9A @ 120Hz |
| Polarization: | Polar |
| Packaging: | Tray |
| Package / Case: | Radial, Can - Screw Terminals |
| Operating Temperature: | -25°C ~ 85°C |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | ERHA551LGC392MEE0M |
| Lifetime @ Temp.: | 5000 Hrs @ 85°C |
| Lead Spacing: | 1.240" (31.50mm) |
| Impedance: | - |
| Height - Seated (Max): | 5.512" (140.00mm) |
| Expanded Description: | 3900µF 550V Aluminum Capacitors Radial, Can - Screw Terminals 5000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | - |
| Description: | CAP ALUM 3900UF 20% 550V SCREW |
| Capacitance: | 3900µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for ERHA551LGC392MEE0M
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers