BYCHIPS is the stocking distributor for EPC2033ENGR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPC2033ENGR by email, we will give you a best price according your plan.
Buy EPC2033ENGR with BYCHPS
Buy with guarantee
EPC2033ENGR
- Part Number:
- EPC2033ENGR
- Manufacturer:
- EPC
- Description:
- TRANS GAN 150V 31A BUMPED DIE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15274 Pieces
- Data sheet:
- EPC2033ENGR.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 2.5V @ 9mA |
|---|---|
| Technology: | GaNFET (Gallium Nitride) |
| Supplier Device Package: | Die |
| Series: | eGaN® |
| Rds On (Max) @ Id, Vgs: | 7 mOhm @ 25A, 5V |
| Power Dissipation (Max): | - |
| Packaging: | Tray |
| Package / Case: | Die |
| Other Names: | 917-EPC2033ENGR |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | EPC2033ENGR |
| Input Capacitance (Ciss) (Max) @ Vds: | 1140pF @ 75V |
| Gate Charge (Qg) (Max) @ Vgs: | 10nC @ 5V |
| FET Type: | N-Channel |
| FET Feature: | - |
| Expanded Description: | N-Channel 150V 31A (Ta) Surface Mount Die |
| Drain to Source Voltage (Vdss): | 150V |
| Description: | TRANS GAN 150V 31A BUMPED DIE |
| Current - Continuous Drain (Id) @ 25°C: | 31A (Ta) |
| Email: | [email protected] |
Related parts for EPC2033ENGR
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
EPC2031ENGR | EPC | TRANS GAN 60V 31A BUMPED DIE | Inquiry |
|
EPC2030ENGR | EPC | TRANS GAN 40V 31A BUMPED DIE | Inquiry |
 |
EPC2034ENGRT | EPC | TRANS GAN 200V 31A BUMPED DIE | Inquiry |
|
EPC2034 | EPC | TRANS GAN 200V 48A BUMPED DIE | Inquiry |
 |
EPC2038 | EPC | TRANS GAN 100V 2.8OHM BUMPED DIE | Inquiry |
|
EPC2033 | EPC | TRANS GAN 150V 7MOHM BUMPED DIE | Inquiry |
|
EPC2032ENGRT | EPC | TRANS GAN 100V 48A BUMPED DIE | Inquiry |
|
EPC2030ENGRT | EPC | MOSFET NCH 40V 31A DIE | Inquiry |
|
EPC2038ENGR | EPC | TRANS GAN 100V 0.5A BUMPED DIE | Inquiry |
|
EPC2033ENGRT | EPC | TRANS GAN 150V 31A BUMPED DIE | Inquiry |
 |
EPC2037ENGR | EPC | TRANS GAN 100V BUMPED DIE | Inquiry |
 |
EPC2036ENGRT | EPC | MOSFET N-CH 100V 1.7A DIE | Inquiry |
|
EPC2032ENGR | EPC | TRANS GAN 100V 48A BUMPED DIE | Inquiry |
|
EPC2032 | EPC | TRANS GAN 100V 48A BUMPED DIE | Inquiry |
 |
EPC2036 | EPC | TRANS GAN 100V 1A BUMPED DIE | Inquiry |
|
EPC2035 | EPC | TRANS GAN 60V 1A BUMPED DIE | Inquiry |
|
EPC2031ENGRT | EPC | MOSFET NCH 60V 31A DIE | Inquiry |
|
EPC2034ENGR | EPC | TRANS GAN 200V 31A BUMPED DIE | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers