BYCHIPS is the stocking distributor for EL9112IL-T7, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EL9112IL-T7 by email, we will give you a best price according your plan.
Buy EL9112IL-T7 with BYCHPS
Buy with guarantee
EL9112IL-T7
- Part Number:
- EL9112IL-T7
- Manufacturer:
- Intersil
- Description:
- IC DIFF RCVR/EQUALZR TRPL 28-QFN
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 13653 Pieces
- Data sheet:
- EL9112IL-T7.pdf
Introduction
Specifications
| Voltage - Supply: | 5V |
|---|---|
| Type: | Receiver |
| Series: | - |
| Protocol: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 28-VFQFN Exposed Pad |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Drivers/Receivers: | 0/3 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | EL9112IL-T7 |
| Expanded Description: | 0/3 Receiver |
| Duplex: | - |
| Description: | IC DIFF RCVR/EQUALZR TRPL 28-QFN |
| Data Rate: | - |
| Email: | [email protected] |
Related parts for EL9112IL-T7
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
EL9112ILZS2714 | Intersil | IC RCVR/EQUALIZER 3CH 28QFN | Inquiry |
 |
EL9112IL | Intersil | IC RCVR/EQLZR DIFF 150MHZ 28-QFN | Inquiry |
|
EL9112ILZ-T7 | Intersil | IC DIFF RCVR/EQUALZR TRPL 28-QFN | Inquiry |
|
EL9112ILZ-T13S2714 | Intersil | IC RCVR/EQUALIZER 3CH 28QFN | Inquiry |
|
EL9112ILZ | Intersil | IC RCVR/EQLZR DIFF 150MHZ 28-QFN | Inquiry |
|
EL9112ILZ-T7S2714 | Intersil | IC RCVR/EQUALIZER 3CH 28QFN | Inquiry |
|
EL9112ILZ-T13 | Intersil | IC DIFF RCVR/EQUALZR TRPL 28-QFN | Inquiry |
 |
EL9115IL-T7 | Intersil | IC ANALOG DELAY LINE TRPL 20-QFN | Inquiry |
|
EL9112IL-T13 | Intersil | IC DIFF RCVR/EQUALZR TRPL 28-QFN | Inquiry |
|
EL9110IUZ | Intersil | IC RECEIVR/EQUALIZER DIFF 16QSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers