BYCHIPS is the stocking distributor for ECA-2VHG330, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ECA-2VHG330 by email, we will give you a best price according your plan.
Buy ECA-2VHG330 with BYCHPS
Buy with guarantee
ECA-2VHG330
- Part Number:
- ECA-2VHG330
- Manufacturer:
- Panasonic
- Description:
- CAP ALUM 33UF 20% 350V RADIAL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14027 Pieces
Introduction
Specifications
| Voltage Rating: | 350V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 0.630" Dia (16.00mm) |
| Series: | NHG |
| Ripple Current: | 195mA @ 120Hz |
| Polarization: | Polar |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Other Names: | ECA2VHG330 |
| Operating Temperature: | -25°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | ECA-2VHG330 |
| Lifetime @ Temp.: | 2000 Hrs @ 105°C |
| Lead Spacing: | 0.295" (7.50mm) |
| Impedance: | - |
| Height - Seated (Max): | 1.063" (27.00mm) |
| Expanded Description: | 33µF 350V Aluminum Capacitors Radial, Can 2000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | - |
| Description: | CAP ALUM 33UF 20% 350V RADIAL |
| Capacitance: | 33µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for ECA-2VHG330
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers