BYCHIPS is the stocking distributor for DSD1608PAHR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DSD1608PAHR by email, we will give you a best price according your plan.
Buy DSD1608PAHR with BYCHPS
Buy with guarantee
DSD1608PAHR
- Part Number:
- DSD1608PAHR
- Manufacturer:
- Description:
- IC DAC 8CH CMOS MONO 52-TQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12065 Pieces
- Data sheet:
- DSD1608PAHR.pdf
Introduction
Specifications
| Voltage Supply Source: | Analog and Digital |
|---|---|
| Voltage - Supply: | 3 V ~ 3.6 V, 5V |
| Type: | DAC, Audio |
| Supplier Device Package: | 52-TQFP (10x10) |
| Series: | - |
| Sampling Rate (Per Second): | 200k |
| Resolution (Bits): | 24 b |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 52-TQFP |
| Other Names: | DSD1608PAHRG4 DSD1608PAHRG4-ND |
| Operating Temperature: | -25°C ~ 85°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | DSD1608PAHR |
| Expanded Description: | DAC, Audio 24 bit 200k DSD, PCM 52-TQFP (10x10) |
| Description: | IC DAC 8CH CMOS MONO 52-TQFP |
| Data Interface: | DSD, PCM |
| Email: | [email protected] |
Related parts for DSD1608PAHR
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MAX127AEAI+ | Maxim Integrated | IC DAS 12BIT 2-WIRE 28-SSOP | Inquiry |
 |
AD1940YSTZ | Analog Devices Inc. | IC DSP AUDIO 16CH/28BIT 48-LQFP | Inquiry |
 |
CS4396-KSZ | Cirrus Logic Inc. | IC DAC 24BIT SRL 192KHZ 28-SOIC | Inquiry |
|
AD7608BSTZ-RL | Analog Devices Inc. | IC DAS W/ADC 18BIT 8CH 64LQFP | Inquiry |
|
DSD1608PAH | Texas Instruments | IC DAC 8CH CMOS MONO 52-TQFP | Inquiry |
 |
MAX11301GTL+T | Maxim Integrated | IC ADC 12BIT 21PORT I2C 40TQFN | Inquiry |
|
MAX199BEAI+ | Maxim Integrated | IC DAS 12BIT 8CH 28-SSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers