BYCHIPS is the stocking distributor for DS92LX2122SQ/NOPB, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DS92LX2122SQ/NOPB by email, we will give you a best price according your plan.
Buy DS92LX2122SQ/NOPB with BYCHPS
Buy with guarantee
DS92LX2122SQ/NOPB
- Part Number:
- DS92LX2122SQ/NOPB
- Manufacturer:
- Description:
- IC DESERIALIZER BI-DIR 48WQFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16546 Pieces
- Data sheet:
- DS92LX2122SQ/NOPB.pdf
Introduction
Specifications
| Voltage - Supply: | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 48-WQFN (7x7) |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 48-WFQFN Exposed Pad |
| Output Type: | Channel Link III (LVCMOS) |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of Outputs: | 21 |
| Number of Inputs: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 7 Weeks |
| Manufacturer Part Number: | DS92LX2122SQ/NOPB |
| Input Type: | Channel Link III (CML) |
| Function: | Deserializer |
| Expanded Description: | 1.05Gbps Deserializer 1 Input 21 Output 48-WQFN (7x7) |
| Description: | IC DESERIALIZER BI-DIR 48WQFN |
| Data Rate: | 1.05Gbps |
| Email: | [email protected] |
Related parts for DS92LX2122SQ/NOPB
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
DS92LX2121SQ/NOPB | Texas Instruments | IC SERIALIZER 21-BIT 40WQFN | Inquiry |
|
DS92LX2122SQX/NOPB | Texas Instruments | IC DESERIALIZER BI-DIR 48WQFN | Inquiry |
|
DS92LX2122SQE/NOPB | Texas Instruments | IC DESERIALIZER BI-DIR 48WQFN | Inquiry |
|
DS92LX2121SQX/NOPB | Texas Instruments | IC SERIALIZER 21-BIT 40WQFN | Inquiry |
|
DS92LX2121SQE/NOPB | Texas Instruments | IC SERIALIZER 21-BIT 40WQFN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers