BYCHIPS is the stocking distributor for DS34S132GN, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for DS34S132GN by email, we will give you a best price according your plan.
Buy DS34S132GN with BYCHPS
Buy with guarantee
DS34S132GN
- Part Number:
- DS34S132GN
- Manufacturer:
- Maxim Integrated
- Description:
- IC TDM/PACKET TRANSPORT 676BGA
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 17542 Pieces
- Data sheet:
- DS34S132GN.pdf
Introduction
Specifications
| Voltage - Supply: | 1.8V, 3.3V |
|---|---|
| Supplier Device Package: | 676-PBGA (27x27) |
| Series: | - |
| Power (Watts): | - |
| Packaging: | Tray |
| Package / Case: | 676-BGA |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | DS34S132GN |
| Interface: | TDMoP |
| Includes: | - |
| Function: | TDM-over-Packet (TDMoP) |
| Expanded Description: | Telecom IC TDM-over-Packet (TDMoP) 676-PBGA (27x27) |
| Description: | IC TDM/PACKET TRANSPORT 676BGA |
| Current - Supply: | - |
| Email: | [email protected] |
Related parts for DS34S132GN
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
DS34S108GN+ | Maxim Integrated | IC TRANSPORT TDM 484BGA | Inquiry |
 |
DS34S104GN+ | Maxim Integrated | IC TRANSPORT TDM 256CSBGA | Inquiry |
 |
DS34S132GNA2+ | Maxim Integrated | IC 32PORT TDM OVER PACKET 676BGA | Inquiry |
|
DS34S101GN | Maxim Integrated | IC TRANSPORT TDM/PACKET 256CSBGA | Inquiry |
|
DS34S132GN+ | Maxim Integrated | IC TDM OVER PACKET 676-BGA | Inquiry |
 |
DS34S101GN+ | Maxim Integrated | IC TRANSPORT TDM SGL 256-CSBGA | Inquiry |
 |
DS34S102GN+ | Maxim Integrated | IC TRANSPORT TDM DUAL 256-CSBGA | Inquiry |
|
DS34S104GN | Maxim Integrated | IC TRANSPORT TDM/PACKET 256CSBGA | Inquiry |
|
DS34S102GN | Maxim Integrated | IC TRANSPORT TDM/PACKET 256CSBGA | Inquiry |
|
DS34S108GN | Maxim Integrated | IC TDM/PACKET TRANSPORT | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers